发明名称 |
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF |
摘要 |
The present invention relates to a printed circuit board and a manufacturing method thereof and, more particularly, to a printed circuit board and a manufacturing method thereof, capable of implementing a thin film through a coreless structure, implementing a fine pitch by forming a metal post, and forming a buried circuit pattern. |
申请公布号 |
KR20150064976(A) |
申请公布日期 |
2015.06.12 |
申请号 |
KR20130149973 |
申请日期 |
2013.12.04 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
BONG, KANG WOOK;LEE, JIN WON;KO, YOUNG GWAN |
分类号 |
H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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