SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME AND RINSING FLUID

摘要

The present invention provides a method for manufacturing a semiconductor device having: a step for applying a semiconductor seal composition on a semiconductor substrate provided with an interlayer insulating layer having a concave section and wiring containing copper of which at least a portion is exposed on at least a portion of the bottom surface of the concave section and forming a seal layer on at least the bottom and side surfaces of the concave portion; and a step for thermally treating at a temperature of 200 425°C the side surface on which the seal layer of the semiconductor substrate is formed and removing at least a portion of the seal layer formed on the exposed surface of the wiring. The semiconductor seal composition has a cationic functional group and contains a polymer having a weight average molecular weight of 2000 1000000 the Na and K content being no more than 10 wt ppb in elemental terms.