CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a chip electronic component and a manufacturing method thereof, and more specifically, to a chip electronic component which forms a thin film insulation layer that an outer magnetic material and a coil pattern are not directly touched by making the insulation layer even at the bottom of the coil pattern without insulation non-formation unit in which the coil pattern is exposed, prevents waveform failure in high frequency, and can improve capacity of an inductor or the like, and to a manufacturing method thereof.