发明名称 |
FLEXIBLE MICROMACHINED TRANSDUCER DEVICE AND METHOD FOR FABRICATING SAME |
摘要 |
Techniques and structures for providing flexibility of a micromachined transducer array. In an embodiment, a transducer array includes a plurality of transducer elements each comprising a piezoelectric element and one or more electrodes disposed in or on a support layer. The support layer is bonded to a flexible layer including a polymer material, wherein flexibility of the transducer array results in part from a total thickness of a flexible layer. In another embodiment, flexibility of the transducer array results in part from one or more flexural structures formed therein. |
申请公布号 |
US2015158052(A1) |
申请公布日期 |
2015.06.11 |
申请号 |
US201314103672 |
申请日期 |
2013.12.11 |
申请人 |
Latev Dimitre;Hajati Arman;Imai Darren Todd;Tran Ut |
发明人 |
Latev Dimitre;Hajati Arman;Imai Darren Todd;Tran Ut |
分类号 |
B06B1/02;B06B1/06;H01L41/04;B32B37/24 |
主分类号 |
B06B1/02 |
代理机构 |
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代理人 |
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主权项 |
1. A method of fabricating a micromachined transducer array, the method comprising:
forming a plurality of transducer elements, including, for each of the plurality of transducer elements:
forming an electrode of the transducer element on a first side of a support layer;forming a piezoelectric element of the transducer element on the first side of the support layer; andforming an interconnect of the transducer element in the support layer, the interconnect coupled to the electrode of the transducer element; after forming the plurality of transducer elements, thinning the support layer to expose a second side of the support layer, wherein the respective interconnects of the plurality of transducer elements extend between the first side and the second side of the support layer; and bonding the second side to a flexible layer, wherein the flexible layer comprises a polymer material and, for each of the respective interconnects of the plurality of transducer elements, a corresponding interconnect extending through the flexible layer. |
地址 |
San Jose CA US |