| 摘要 |
PROBLEM TO BE SOLVED: To provide a connection structure between substrates which secures good connection state between wirings provided at separated substrates and achieves downsizing. ! SOLUTION: A connection structure of substrates includes: a conductive member having conductivity and provided between a first substrate and a second substrate which are separated from each other; and a fastening member which fastens the first substrate to the second substrate with the conductive member sandwiched between the first substrate and the second substrate. The conductive member includes a contact part having a plate-like shape, the contact part including one side of the plate-like shape contacted with a first wiring pattern provided on the first substrate and the other side of the plate-like shape contacted with a second wiring pattern provided on the second substrate. ! COPYRIGHT: (C)2015,JPO&INPIT |
