发明名称 METHOD FOR MANUFACTURING DISPLAY DEVICE, DISPLAY DEVICE, BONDING METHOD AND BONDING DEVICE
摘要 PROBLEM TO BE SOLVED: To effectively perform bonding in sealing. ! SOLUTION: The method for manufacturing the display device that is a method for manufacturing a display device in which a first substrate and a second substrate are bonded in a bonding region around a display area where a light emitting element is provided, comprises: a step of forming a bond part on a bonding region of at least one of the first substrate and the second substrate; a step of activating surfaces of bonding regions of the first substrate and the second substrate; a step of bring the bonding region of the first substrate into contact with the bonding region of the second substrate; and a step of bonding the first substrate and the second substrate via the bond part by applying high pressure to them from outside of the substrate from the display region in the bonding region. ! COPYRIGHT: (C)2015,JPO&INPIT
申请公布号 JP2015109233(A) 申请公布日期 2015.06.11
申请号 JP20130252134 申请日期 2013.12.05
申请人 SAMSUNG DISPLAY CO LTD 发明人 MORIMOTO KAZUNORI
分类号 H05B33/10;H01L51/50;H05B33/04 主分类号 H05B33/10
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