| 发明名称 |
FILM FOR SEMICONDUCTOR DEVICE PRODUCTION, METHOD FOR PRODUCING FILM FOR SEMICONDUCTOR DEVICE PRODUCTION, AND METHOD FOR SEMICONDUCTOR DEVICE PRODUCTION |
| 摘要 |
The present invention relates to a film for semiconductor device production, which includes: a separator; and a plurality of adhesive layer-attached dicing tapes each including a dicing tape and an adhesive layer laminated on the dicing tape, which are laminated on the separator at a predetermined interval in such a manner that the adhesive layer attaches to the separator, in which the separator has a cut formed along the outer periphery of the dicing tape, and the depth of the cut is at most ⅔ of the thickness of the separator. |
| 申请公布号 |
US2015162236(A1) |
申请公布日期 |
2015.06.11 |
| 申请号 |
US201514624702 |
申请日期 |
2015.02.18 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
TAKAMOTO Naohide;SHIGA Goji;ASAI Fumiteru |
| 分类号 |
H01L21/683;C09J7/02;B32B38/10;B32B37/12;B32B38/00 |
主分类号 |
H01L21/683 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A film for semiconductor device production, which comprises:
a separator; and a plurality of adhesive layer-attached dicing tapes each comprising a dicing tape and an adhesive layer laminated on the dicing tape, which are laminated on the separator at a predetermined interval in such a manner that the adhesive layer attaches to the separator, wherein the separator has a cut formed along the outer periphery of the dicing tape, wherein the depth of the cut is at most ⅔ of the thickness of the separator, and wherein the film for semiconductor device production is in a form of being wound as a roll. |
| 地址 |
Osaka JP |
