| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser processing method which enables a processing workpiece to be suitably split only by irradiation with laser beams. ! SOLUTION: The method comprises: a modified layer forming step, where a modified layer (21) consisting of cracks (C1) along a split schedule line (17) is formed by irradiating a processing workpiece (11) with a penetrating laser beam (L1); and a laser processed groove forming step, where a laser processed groove (23) along the split schedule line with a modified layer (21) is formed by irradiating a processing workpiece with a modified layer along the split schedule line with an absorbable laser beam (L2). The modified layer and the laser processed groove are formed so that a total of the thickness (t) of the modified layer formed in the modified layer forming step and the depth (d) of the laser processed groove formed in the laser processed groove forming step may be above the thickness (T) of the processing workpiece. ! COPYRIGHT: (C)2015,JPO&INPIT |
