发明名称 |
Full Tensor Micro-Impedance Imaging |
摘要 |
Various systems and methods for implementing and using a full tensor micro-impedance downhole imaging tool that includes downhole emitters that induce, at azimuthally-spaced positions on a borehole wall, fields having components in three different non-coplanar directions within a formation and directionally sensitive downhole sensors that sense the components caused by each emitter. The tool further includes a downhole controller that processes signals received from the directionally sensitive downhole sensors to provide a set of measurements representative of a 3×3 impedance tensor at each position. |
申请公布号 |
US2015160365(A1) |
申请公布日期 |
2015.06.11 |
申请号 |
US201214411500 |
申请日期 |
2012.06.29 |
申请人 |
Donderici Burkay;Celepcikay Ferhat T.;San Martin Luis E. |
发明人 |
Donderici Burkay;Celepcikay Ferhat T.;San Martin Luis E. |
分类号 |
G01V3/20;G01V3/02 |
主分类号 |
G01V3/20 |
代理机构 |
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代理人 |
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主权项 |
1. A downhole imaging tool that comprises:
one or more downhole emitters that induce, at azimuthally-spaced positions, a plurality of fields having components in non-coplanar directions within a formation; one or more directionally sensitive downhole sensors that sense the components caused by each emitter; and a downhole controller that processes signals received from the one or more directionally sensitive downhole sensors to provide a plurality of measurement sets, wherein each measurement set is representative of an impedance tensor greater than 2×2 at each of said azimuthally spaced positions. |
地址 |
Houston TX US |