发明名称 Full Tensor Micro-Impedance Imaging
摘要 Various systems and methods for implementing and using a full tensor micro-impedance downhole imaging tool that includes downhole emitters that induce, at azimuthally-spaced positions on a borehole wall, fields having components in three different non-coplanar directions within a formation and directionally sensitive downhole sensors that sense the components caused by each emitter. The tool further includes a downhole controller that processes signals received from the directionally sensitive downhole sensors to provide a set of measurements representative of a 3×3 impedance tensor at each position.
申请公布号 US2015160365(A1) 申请公布日期 2015.06.11
申请号 US201214411500 申请日期 2012.06.29
申请人 Donderici Burkay;Celepcikay Ferhat T.;San Martin Luis E. 发明人 Donderici Burkay;Celepcikay Ferhat T.;San Martin Luis E.
分类号 G01V3/20;G01V3/02 主分类号 G01V3/20
代理机构 代理人
主权项 1. A downhole imaging tool that comprises: one or more downhole emitters that induce, at azimuthally-spaced positions, a plurality of fields having components in non-coplanar directions within a formation; one or more directionally sensitive downhole sensors that sense the components caused by each emitter; and a downhole controller that processes signals received from the one or more directionally sensitive downhole sensors to provide a plurality of measurement sets, wherein each measurement set is representative of an impedance tensor greater than 2×2 at each of said azimuthally spaced positions.
地址 Houston TX US