TWO PART DUAL-CURE ADHESIVE FOR USE IN ELECTRONICS

摘要

The disclosure relates to a two-part dual-cure adhesive composition comprising a first Part (A) comprising a radiation polymerizable polyisocyanate prepolymer and a second Part (B) comprising a polyol. The disclosed adhesive can be used on substrates with electronic components to make electronic assemblies.

主权项

1. A method of making an electronic assembly comprising:
applying a two-part dual-cure adhesive composition to at least a portion of a first substrate, the adhesive composition comprising a Part (A) that comprises a radiation polymerizable polyisocyanate prepolymer and a Part (B) that comprises a polyol; and contacting the adhesive on the first substrate with at least a portion of a second substrate, at least one of the first and second substrates comprising at least one electronic component prior to applying the adhesive composition.