POLISHING COMPOSITION AND POLISHING METHOD

摘要

A polishing composition contains cerium oxide particles, at least one selected from a methonium compound and an alkanolamine compound which is a primary or secondary alkanolamine compound, and a cyclic oligosaccharide of 0.005 mass % or more to less than 0.1 mass % and/or a nonionic surfactant of 0.0007 mass % or more to 1.7 mass % or less which has an acetylenic group and to which an ethylene oxide is added, wherein a pH is 3.5 or more to less than 6. A polishing method includes bringing a surface to be polished of an object into contact with a polishing pad while a polishing composition according to claim 1 is supplied to the polishing pad, and polishing by a relative movement between the surface of the object and the polishing pad.

主权项

1. A polishing composition, comprising:
cerium oxide particles; at least one kind selected from a group consisting of a methonium compound and an alkanolamine compound; and a cyclic oligosaccharide with a concentration of 0.005 mass % or more to less than 0.1 mass % and/or a nonionic surfactant with a concentration of 0.0007 mass % or more to 1.7 mass % or less, the nonionic surfactant having a structure in which an ethylene oxide is added to a main chain having an acetylenic group, wherein the alkanolamine compound is a primary or secondary alkanolamine compound, and a pH is 3.5 or more to less than 6.