SYSTEMS AND METHODS FOR DETERMINING AND ADJUSTING A LEVEL OF PARALLELISM RELATED TO BONDING OF SEMICONDUCTOR ELEMENTS

摘要

A bonding machine for bonding a semiconductor device comprises a support structure configured to support a substrate; a bond head assembly including a bonding tool configured to bond multiple semiconductor devices to a substrate; and a correction tool including a contact part configured to be located between the bonding tool and the support structure, wherein the contact part is configured to contact by each of the bonding tool and the support structure during a correction work.