SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD

摘要

Provided in the present invention is a substrate treating apparatus. The substrate treating apparatus comprises a housing; a spin head arranged inside the housing, and supporting a substrate; and a washing unit including multiple nozzles provided to a lower part of the spin head, and spraying a washing solution to a bevel part of the substrate, wherein multiple nozzles can be provided with different distance from the center of the spin head.