| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermocompression bonding apparatus capable of adjustment of the temperature of a substrate for a display panel. ! SOLUTION: A thermocompression bonding apparatus includes: a placement portion 6 on which a substrate 3 for a display panel is placed; a heat-pressing portion 7 that heat-presses an overlapping portion 5, where the substrate 3 for a display panel and an FPC 4 overlapping with a part of the substrate 3 for a display panel overlap with each other, in the overlapping direction; and a temperature adjustment portion 8 that adjusts the temperature of the placement portion 6. The heat-pressing portion 7 preferably includes a lower heat tool 14 that is in contact with the substrate 3 for a display panel in the overlapping portion 5 and that heats the overlapping portion 5 from the substrate 3 for a display panel, an upper heat tool 13 that is in contact with the FPC 4 in the overlapping portion 5 and that heats the overlapping portion 5 from the FPC 4, and a lifting |
