| 发明名称 |
LASER ASHING OF POLYIMIDE FOR SEMICONDUCTOR MANUFACTURING |
| 摘要 |
A system for laser ashing of polyimide for a semiconductor manufacturing process is provided. The system includes: a semiconductor chip, a top chip attached to the semiconductor chip by a connection layer, a supporting material, a polyimide glue layer disposed between the supporting material and semiconductor chip, a plasma asher, and an ashing laser configured to ash the polyimide glue on the semiconductor chip. |
| 申请公布号 |
US2015162300(A1) |
申请公布日期 |
2015.06.11 |
| 申请号 |
US201514624601 |
申请日期 |
2015.02.18 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Cadotte Maxime;Guerin Luc;Truong Van Thanh;Whitehead Steve |
| 分类号 |
H01L23/00;B32B38/10;B32B38/00;B32B43/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A system for laser ashing of polyimide for a semiconductor manufacturing process, the system comprising:
a semiconductor chip; a top chip attached to the semiconductor chip by a connection layer; a supporting material; a polyimide glue layer disposed between the supporting material and semiconductor chip; a plasma asher; and an ashing laser configured to ash the polyimide glue on the semiconductor chip. |
| 地址 |
Armonk NY US |
