RIGID SUBSTRATE WITH PROTECTED END SURFACES, AND METHOD FOR MANUFACTURING SAME

摘要

Provided is a rigid substrate (11) having a protective layer (17) that, while maintaining exceptional capability for protecting the end surfaces, can be formed to low thickness so as to avoid interference during adhesion of a film or the like to the principal surfaces. The method for manufacturing the rigid substrate (11), the end surfaces of which are covered by the protective layer (17), includes: a step (1) for producing a rigid substrate laminate in which at least three rigid substrates (11) are adhered to one another with adhesive layers (12) interposed therebetween; a step (2) for trimming the end surfaces of the rigid substrates (11) that constitute the rigid substrate laminate, the end surfaces being trimmed such that the adhesive layers (12) protrude out relatively with respect to the end surfaces of the rigid substrates (11); a step (3), performed subsequent to carrying out step (2), for covering the end surfaces of the rigid substrates (11) with a curable resin; a step (4) for curing the curable resin and forming a protective film (17); and a step (5) for separating the rigid substrates (11) from the rigid substrate laminate.