SEMICONDUCTOR-JOINING ADHESIVE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE.

摘要

The purpose of the present invention is to provide a semiconductor-joining adhesive which has high storage stability and excellent flux characteristics and connection reliability. An additional purpose of the present invention is to provide a method for producing a semiconductor device which uses the semiconductor-joining adhesive, and a semiconductor device produced using the semiconductor-joining adhesive. The present invention pertains to a semiconductor-joining adhesive containing an epoxy compound, a curing agent, a curing accelerator, and a flux activator, wherein: the curing accelerator contains an amine compound; the flux activator is an organic acid flux activator; the curing accelerator content is 2-20 parts by weight, given that the total content of components having an epoxy group in the semiconductor-joining adhesive is 100 parts by weight; and the curing accelerator content is 40-500 parts by weight, given that the flux activator content constitutes 100 parts by weight.