CHIP PACKAGE AND METHOD FOR FORMING THE SAME

摘要

An embodiment of the invention provides a chip package which includes: a first chip; a second chip disposed on the first chip, wherein a side surface of the second chip is a chemically-etched surface; and a bonding bulk disposed between the first chip and the second chip such that the first chip and the second chip are bonded with each other.

主权项

1. A method for forming a chip package, comprising:
providing a first substrate; providing a second substrate; forming at least a bonding bulk on an upper surface of the first substrate and/or on a lower surface of the second substrate; bonding the second substrate onto the first substrate through the bonding bulk; forming a first protection layer on an upper surface of the second substrate, wherein the first protection layer has an opening exposing a predetermined scribe region of the second substrate; using the first protection layer as a mask to chemically-etch and remove a portion of the second substrate located in the predetermined scribe region to form a through-hole exposing the first substrate; and partially removing the first substrate exposed by the through-hole to form at least one chip package.