POLISHING COMPOSITION AND POLISHING METHOD

摘要

A polishing composition contains cerium oxide particles of 50 nm or more to 160 nm or less in average secondary particle diameter and at least one kind of nitride film polishing accelerating agent selected from a group consisting of a methonium compound and a primary or secondary alkanolamine compound, wherein a concentration of the methonium compound is 1.0 mass % or less, and a pH is 3.5 or more to less than 6. A polishing method includes bringing a surface to be polished of an object into contact with a polishing pad while a polishing composition according to claim 1 is supplied to the polishing pad, and polishing by a relative movement between the surface of the object and the polishing pad.

主权项

1. A polishing composition, comprising:
cerium oxide particles; and at least one kind of nitride film polishing accelerating agent selected from a group consisting of a methonium compound and an alkanolamine compound; wherein the alkanolamine compound is a primary or secondary alkanolamine compound, an average secondary particle diameter of the cerium oxide particles is 50 nm or more to 160 nm or less, a concentration of the methonium compound is 1.0 mass % or less, and a pH is 3.5 or more to less than 6.