HIGHLY-THERMALLY-CONDUCTIVE RESIN COMPOSITION, AND RESIN MATERIAL FOR HEAT DISSIPATION/HEAT TRANSFER AND THERMALLY CONDUCTIVE FILM COMPRISING SAME

摘要

The present invention relates to a resin composition that can be processed into a molded article that has excellent thermal conductivity and is thin and flexible, and relates to a resin material for heat dissipation/heat transfer and a thermally conductive film that contain said resin composition. The resin composition is characterized by comprising 40-60 mol% of a unit (A) having a biphenyl group, and 5-40 mol% of straight-chain units (B) and (C) respectively, and is further characterized by containing a resin having a thermal conductivity of at least 0.4 W/(m·K) in the resin alone, and an inorganic filling material having a thermal conductivity of at least 1W/(m·K).