发明名称 HEAT-CURABLE RESIN COMPOSITION
摘要 [Problem] To provide a heat-curable resin composition that has superior storage stability, has rapid curing characteristics, and when affixing a neodymium magnet, is capable of stable affixing even after a durability test. [Solution] The heat-curable resin composition contains the belowmentioned (A) to (D), and contains 25-75 mass% of component (A) with respect to the total of component (A) and component (B): (A) an epoxy resin; (B) a cyanate ester resin; (C) a first curing agent resulting from containing a phenolic resin and a modified amine compound that is the belowmentioned component (C1), and a second curing agent resulting from containing a phenolic resin and a modified amine compound that is the belowmentioned component (C2), where component (C1) is a modified amine compound resulting from reacting an epoxy compound and a polyamine compound having at least one of one or more tertiary amino groups, one or more primary amino groups, and a secondary amino group, and component (C2) is a modified amine compound not containing a tertiary amine in the molecule and having a secondary amino group and/or two primary amino groups differing in reactivity, and a modified amine compound not containing a tertiary amine in the molecule and having a secondary amino group and/or at least two primary amino groups, by means of a structure resulting from reacting one of the amino groups with an epoxy group, the reactivity of the remaining amino groups and epoxy groups is decreased, and having at least one amino group having an active hydrogen in the molecule resulting from reacting an epoxy compound and at least one polyamine compound selected from the group consisting of an aliphatic polyamine, an alicyclic polyamine, and an aromatic polyamine; and (D) an organic filler.
申请公布号 WO2015083622(A1) 申请公布日期 2015.06.11
申请号 WO2014JP81439 申请日期 2014.11.27
申请人 THREE BOND FINE CHEMICAL CO., LTD. 发明人 SAKAMOTO, HIROKI;OSADA, MASAYUKI;INOUE, MANABU
分类号 C08L63/00;C08G59/20 主分类号 C08L63/00
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