| 摘要 |
A package structure comprises: a line carrier plate (100), the line carrier plate (100) comprising a first surface (11) and a second surface (12) opposite to the first surface (11), several carrying units arranged in a matrix being provided on the line carrier plate (100), the first surface (11) of the carrying unit being provided with several input bonding pads (101), the second surface (12) of the carrying unit being provided with several output bonding pads (102), and the input bonding pads (101) being connected to the output bonding pads (102) by an interconnection structure (103); a pre-packaged panel, the pre-packaged panel comprising a first plastic package layer (205), several integrated units arranged in a matrix being provided in the first plastic package layer (205), each of the integrated units being provided therein with at least one semiconductor chip (200), a surface of the semiconductor chip (200) being provided with several bonding pads (201), and each of the bonding pads (201) being provided with a first metal protrusion (203); a filling layer (209) that fills a space between the first surface (11) of the carrying unit and the pre-packaged panel; and second metal protrusions (210) located on the output bonding pads (102) on the second surface (12) of the carrying unit. The pre-packaged panel is inversely mounted on the first surface (11) of the line carrier plate (100), and the first metal protrusions (203) and the input bonding pads (101) are soldered together. The integration level of the package structure is improved. |
