SEMICONDUCTOR CHIP AND THE METHOD OF FORMING THE SAME

摘要

The present invention provides a semiconductor chip and a manufacturing method thereof. The semiconductor chip according to the present invention comprises: pads provided on top of a substrate; protective patterns provided on top of the substrate and having a plurality of opening parts; under-bump patterns provided in the opening parts, respectively; and bumps provided on the under-bump pattern, respectively. The protective patterns can be separated laterally from each other. The semiconductor chip according to the present invention can have a warpage phenomenon mitigated.