LIGHT EMITTING DIODE MODULE

摘要

A light emitting diode module includes a lead frame, a first light emitting diode chip, a second light emitting diode chip, an encapsulant, and a lens structure. The lead frame has a die-bonding surface and a side wall together defining an accommodating recess. The encapsulant is filled in the accommodating recess, and covers the first and the second light emitting diode chips. The lens structure disposed on the lead frame has a bottom surface, a reflective surface, a first, a second, a third, and a fourth light emitting curved surface. The light emitting curved surfaces are respectively disposed opposite to the bottom surface. An adjacent position among the light emitting curved surfaces is a lowest point nearest to the bottom surface. The first and the second light emitting diode chips are disposed at the projections of the first and the second light emitting curved surface on the die-bonding surface.

主权项

1. A light emitting diode module, comprising:
a lead frame having a die-bonding surface and at least one side wall together defining an accommodating recess; a first light emitting diode chip and a second light emitting diode chip separately disposed on the die-bonding surface of the lead frame; an encapsulant filled in the accommodating recess and covering the first and the second light emitting diode chips; and a lens structure disposed on the lead frame, the lens structure having a first light emitting curved surface, a second light emitting curved surface, a third light emitting curved surface, a fourth light emitting curved surface, a bottom surface, and at least one reflective surface, wherein the first, the second, the third, and the fourth light emitting curved surfaces are disposed opposite to the bottom surface; an adjacent position among the first, the second, the third, and the fourth light emitting curved surfaces is a lowest point nearest to the bottom surface; the first and the second light emitting curved surfaces are symmetric with respect to the lowest point; the third and the fourth light emitting curved surfaces are symmetric with respect to the lowest point; the third light emitting curved surface is adjacent to the first and the second light emitting curved surfaces and the fourth light emitting curved surface is adjacent to the first and the second light emitting curved surfaces, wherein the reflective surface is connected to the first, the second, the third, the fourth light emitting curved surfaces, and edges of the bottom surface, wherein the first and the second light emitting diode chips are respectively disposed at projections of the first and the second light emitting curved surfaces on the die-bonding surface, and a projection of the lowest point on the die-bonding surface is between the first and the second light emitting diode chips.