NANO-/MICRO-PARTICLE MIXED LEAD-FREE SOLDER PASTE HAVING SIZE EFFECTS, AND METHOD FOR PREPARATION THEREOF

摘要

A nano-/micro-particle mixed lead-free solder paste having size effects, comprising, by weight percent: lead-free nano solder powder 20-70%, flux/paste 4-20%, and lead-free submicro/micro solder powder 20-70%. The invention also relates to a method for preparation of the nano-/micro-particle mixed lead-free solder paste having size effects. By means of the addition of large-size micro solder to a nano solder paste, not only are the specific gravities of the metal components in the solder paste increased, but the low melting point attribute of the nano solder is also retained.