| 发明名称 |
SEMICONDUCTOR MODULE |
| 摘要 |
A semiconductor module is provided with a plurality of chip-type passive components, a conductive supporting member onto which the plurality of chip-type passive components are mounted, and a resin sealing part covering the plurality of chip-type passive components and at least a portion of the conductive supporting member. The plurality of chip-type passive components each include a semiconductor substrate, a plurality of electrodes formed on the semiconductor substrate, and a passive circuit connected between the plurality of electrodes. |
| 申请公布号 |
US2015162327(A1) |
申请公布日期 |
2015.06.11 |
| 申请号 |
US201414559431 |
申请日期 |
2014.12.03 |
| 申请人 |
ROHM CO., LTD. |
发明人 |
NIIYAMA Masashi |
| 分类号 |
H01L27/08;H01L23/525;H01L27/06;H01L23/28 |
主分类号 |
H01L27/08 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor module comprising:
a plurality of chip-type passive components each including a semiconductor substrate, a plurality of electrodes formed on the semiconductor substrate, and a passive circuit formed on the semiconductor substrate and connected between the plurality of electrodes; a conductive supporting member onto which the plurality of chip-type passive components are mounted; and a resin sealing part covering the plurality of chip-type passive components and at least a portion of the conductive supporting member. |
| 地址 |
Kyoto-shi JP |
