Array Based Fabrication of Power Semiconductor Package with Integrated Heat Spreader

摘要

In one implementation, a method of fabricating a power semiconductor package is disclosed. The method includes providing a conductive carrier array including a plurality of power modules held together with connecting bars, where each of the plurality of power modules includes a control transistor, a sync transistor, and a driver IC. The method further includes overlying on the conductive carrier array a heat spreader array including a plurality of power electrode heat spreaders such that each of the plurality of power electrode heat spreaders couples a drain of the sync transistor to a source of the control transistor in each power module.

主权项

1. A method of fabricating a power semiconductor package, said method comprising:
providing a conductive carrier array including a plurality of power modules held together with connecting bars; each of said plurality of power modules including a control transistor, a sync transistor, and a driver IC; overlying on said conductive carrier array a heat spreader array including a plurality of power electrode heat spreaders such that each of said plurality of power electrode heat spreaders couples a drain of said sync transistor to a source of said control transistor in each power module.