LEADFRAME, PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME

摘要

A leadframe, a package assembly and methods for manufacturing the same are disclosed. A plurality of electronic devices are stacked in a plurality of levels in the package assembly. The leadframe includes a plurality of leads having interconnect areas. The plurality of leads are grouped so that the interconnect areas of each group of leads have a height corresponding to one level of electronic devices. In the package assembly, the interconnect areas of each group of leads are soldered to one level of electronic devices. The leadframe and the package assembly result in increased packaging density, less usage of bonding wires in the package assembly, and improve reliability. The method for manufacturing the package assembly reduces adverse effects of a reflow process on properties of the electronic devices, and thus further improves reliability of the package assembly.

主权项

1. A leadframe for stacking a plurality of levels of electronic devices, comprising a plurality of leads each having an interconnect area,
wherein said plurality of leads are grouped so that interconnect areas of each group of said leads have a height corresponding to one level of electronic devices.