Fan Out Package Structure and Methods of Forming

摘要

Packages and methods of forming packages are disclosed. According to an embodiment, a structure comprises a die comprising an electrical pad on an active side, and an encapsulant laterally around the die and extending directly over the active side of the die. A conductive pattern is over the encapsulant, and the conductive pattern comprises a via in an opening through the encapsulant to the electrical pad. The via contacts the electrical pad. In some embodiments, a dielectric layer is over the encapsulant, and the conductive pattern is over the dielectric layer. In other embodiments, the encapsulant is a dielectric-encapsulant, and the conductive pattern adjoins the dielectric-encapsulant. In some embodiments, the encapsulant may be a photo-patternable material, a molding compound, or an Ajinomoto Build-up Film. The structure may further comprise additional dielectric layers and conductive patterns.

主权项

1. A structure comprising:
a die comprising an electrical pad on an active side; an encapsulant laterally around the die and extending directly over the active side of the die; and a first conductive pattern over the encapsulant, the first conductive pattern comprising a first via in a first opening through the encapsulant to the electrical pad, the first via contacting the electrical pad.