SOLDER SUPPLY DEVICE

摘要

A solder supply device (26) comprises: a solder cup (70) which is formed in the shape of a tube open at one end and inside which fluid solder is accommodated; a nozzle portion (88) which is inserted into the solder cup, for discharging the solder inside the solder cup to the outside; a flange portion (90) which is provided on an outer peripheral portion of the nozzle portion and which fits inside the solder cup; and an outer tube (72) which together with the bottom surface of the solder cup demarcates an air chamber. Solder is supplied from the distal end of the nozzle portion by causing the solder cup and the flange portion to move relative to each other, by supplying air to the air chamber. Thus according to this solder supply device, solder can be supplied from a solder container without the use of an air cylinder, an electromagnetic motor or the like.