发明名称 OPTICAL SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SYSTEM, MANUFACTURING CONDITION DETERMINATION DEVICE AND MANUFACTURING MANAGEMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an optical semiconductor device manufacturing method which adjusts a coating layer to have a uniform thickness thereby to achieve excellent luminescent efficiency and reduces the number of processes thereby to improve manufacturing efficiency; and provide a system, a manufacturing condition determination device and a manufacturing management device for determining and managing a manufacturing condition of the optical semiconductor device manufacturing method.SOLUTION: A manufacturing method of an optical semiconductor device 20 comprises: a varnish manufacturing process S1 of manufacturing a varnish 11 which contains particles and a hardening resin; an encapsulation layer manufacturing process S2 of manufacturing an A-stage encapsulation layer 12 from the varnish 11; and an encapsulation process S3 of encapsulating an optical semiconductor element 13 by means of the A-stage encapsulation layer 12.
申请公布号 JP2015109340(A) 申请公布日期 2015.06.11
申请号 JP20130251346 申请日期 2013.12.04
申请人 NITTO DENKO CORP 发明人 KATAYAMA HIROYUKI;ITO HISATAKA;MITANI MUNEHISA
分类号 H01L33/54;H01L21/02 主分类号 H01L33/54
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