发明名称 |
OPTICAL SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SYSTEM, MANUFACTURING CONDITION DETERMINATION DEVICE AND MANUFACTURING MANAGEMENT DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor device manufacturing method which adjusts a coating layer to have a uniform thickness thereby to achieve excellent luminescent efficiency and reduces the number of processes thereby to improve manufacturing efficiency; and provide a system, a manufacturing condition determination device and a manufacturing management device for determining and managing a manufacturing condition of the optical semiconductor device manufacturing method.SOLUTION: A manufacturing method of an optical semiconductor device 20 comprises: a varnish manufacturing process S1 of manufacturing a varnish 11 which contains particles and a hardening resin; an encapsulation layer manufacturing process S2 of manufacturing an A-stage encapsulation layer 12 from the varnish 11; and an encapsulation process S3 of encapsulating an optical semiconductor element 13 by means of the A-stage encapsulation layer 12. |
申请公布号 |
JP2015109340(A) |
申请公布日期 |
2015.06.11 |
申请号 |
JP20130251346 |
申请日期 |
2013.12.04 |
申请人 |
NITTO DENKO CORP |
发明人 |
KATAYAMA HIROYUKI;ITO HISATAKA;MITANI MUNEHISA |
分类号 |
H01L33/54;H01L21/02 |
主分类号 |
H01L33/54 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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