KITS AND COMPONENTS FOR MANUFACTURING INLAYS

摘要

Forming antenna structures having turns of wire, foil or conductive material on a an antenna substrate or in a layer of adhesive layer on a carrier substrate, transferring the antenna structures individually or many at once to corresponding transponder sites on an inlay substrate and connecting the aligned termination ends of the antenna structures to terminal areas of RFID chip modules at the transponder sites. Transferring may be performed by various means such as laminating (heat and pressure), or heating the antenna structures directly or indirectly. The antenna substrate may be in web format or sheet format. Automated manufacturing procedures are disclosed. Kits having components for manufacturing inlay substrates, inlays and secure documents are disclosed. Various features of an inlay substrate and chip module are disclosed.

主权项

1. A kit for RFID inlays comprising at least one of the following components:
an antenna component comprising an antenna substrate and a plurality of antenna structures formed on the antenna substrate; a wire component comprising an insulated wire having areas where insulation has been removed, said areas spaced a distance apart corresponding to a desired length of an antenna for the RFID inlay; an inlay substrate component comprising an inlay substrate prepared with a recess for receiving a chip module and at least one of:
channels for receiving an antenna wire,a wide trench for receiving at least a portion of an antenna structure,an antenna wire with squiggles at its ends for receiving terminal areas of a chip module,trenches extending to near or into the recess,notches in sides of the recess for receiving pins,bumps extending from sides of the recess for stabilizing a chip module from moving when it is in the recess,slots disposed adjacent the recess for holding a chip module in the recess,perforations disposed around the recess.