| 发明名称 |
Conductive Paste for Forming Conductive Film for Semiconductor Devices, Semiconductor Device, and Method for Producing Semiconductor Device |
| 摘要 |
Disclosed herein is a conductive paste for forming a conductive film, including: (A) a conductive powder; (B) as a first additive, at least one selected from a first group consisting of Se, Te, a compound containing Se, and a compound containing Te; (C) as a second additive, a compound containing at least one element selected from a second group consisting of V, Nb, Ta, Sb, Bi, Mn, Ge, Si, and W; (D) glass frit; (E) an organic binder; and (F) a solvent. |
| 申请公布号 |
US2015159025(A1) |
申请公布日期 |
2015.06.11 |
| 申请号 |
US201414562512 |
申请日期 |
2014.12.05 |
| 申请人 |
KYOTO ELEX CO., LTD. |
发明人 |
Takagi Kazuya;Nakatani Seiichi;Harigae Kenichi;Ochiai Nobuo;Nakayama Masashi;Otani Kairi;Hayashida Nozomu |
| 分类号 |
C09D5/24;H01L21/288;H01L31/0224;H01L23/482 |
主分类号 |
C09D5/24 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A conductive paste for forming a conductive film for use in forming a conductive film of a semiconductor device, comprising:
(A) a conductive powder; (B) as a first additive, at least one selected from a first group consisting of Se, Te, a compound containing Se, and a compound containing Te; (C) as a second additive used in combination with the first additive, a compound containing at least one element selected from a second group consisting of V, Nb, Ta, Sb, Bi, Mn, Ge, Si, and W; (D) glass frit; (E) an organic binder; and (F) a solvent. |
| 地址 |
Kyoto-shi JP |
