发明名称 TWO-LAYERED FLEXIBLE WIRING SUBSTRATE, AND FLEXIBLE WIRING BOARD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a two-layered flexible wiring substrate and a flexible wiring board using the same, which are of excellent folding resistance. ! SOLUTION: A two-layered flexible wiring substrate has a multilayered structure of an underlying metal layer and a copper layer, wherein: the underlying metal layer is composed of nickel alloy; the copper layer is provided onto the surface of the underlying metal layer; and the two-layered flexible wiring substrate is provided on the surface of a polyimide film with no intervening adhesive. The two-layered flexible wiring substrate is characterized in that: the difference d[(200)/(111)] in the crystal orientation ratio [(200)/(111)] of the copper layer obtained before and after conducting the folding resistance test stipulated in JIS C-5016-1994 is 0.03 or greater; the crystal orientation ratio index in the (111) surface of the copper layer is 1.2 or greater; and the crystallite diameter thereof is 300 nm or greater. ! COPYRIGHT: (C)2015,JPO&INP
申请公布号 JP2015108187(A) 申请公布日期 2015.06.11
申请号 JP20140214216 申请日期 2014.10.21
申请人 SUMITOMO METAL MINING CO LTD 发明人 NOGUCHI MASASHI ; TAKENOUCHI HIROSHI ; NISHIYAMA YOSHIHIDE ; SHIMAMURA TOMIO ; KOGAMI MASASHI ; HATA HIROKI
分类号 C25D5/56;H05K1/09 主分类号 C25D5/56
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