| 发明名称 |
RADIO-FREQUENCY DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME |
| 摘要 |
An electronic device package has a base and an electronic device chip mounted on the base. The electronic device chip includes a semiconductor substrate having a front side and a back side, a electronic component disposed on the front side of the semiconductor substrate, an interconnect structure disposed on the electronic component, a through hole formed through the semiconductor substrate from the back side of the semiconductor substrate, connecting to the interconnect structure, and a TSV structure disposed in the through hole. The interconnect structure is electrically connected to the RF component, and a thickness of the semiconductor substrate is less than that of the interconnect structure. |
| 申请公布号 |
US2015162267(A1) |
申请公布日期 |
2015.06.11 |
| 申请号 |
US201514621682 |
申请日期 |
2015.02.13 |
| 申请人 |
MediaTek Inc. |
发明人 |
YANG Ming-Tzong;HUNG Cheng-Chou;LEE Tung-Hsing;HUANG Wei-Che;HUANG Yu-Hua |
| 分类号 |
H01L23/48;H01L23/00 |
主分类号 |
H01L23/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic device package, comprising:
a base; and an electronic device chip mounted on the base, wherein the electronic device chip comprises: a semiconductor substrate having a front side and a back side; a electronic component disposed on the front side of the semiconductor substrate; an interconnect structure disposed on the electronic component, wherein the interconnect structure is electrically connected to the RF component, and a thickness of the semiconductor substrate is less than that of the interconnect structure; a through hole formed through the semiconductor substrate from the back side of the semiconductor substrate, connecting to the interconnect structure; and a TSV structure disposed in the through hole. |
| 地址 |
Hsin-Chu TW |
