| 发明名称 |
SYSTEM AND METHOD FOR MANUFACTURING A CAVITY DOWN FABRICATED CARRIER |
| 摘要 |
A method of fabricating a receptacle down BGA carrier having a top surface and a bottom surface, the method comprising combining a conductive portion and a molded dielectric portion, said dielectric portion having an inner surface intersecting said top surface, said inner surface forming a cavity for receiving a die; selectively etching part of said conductive portion; and applying solder resist to a portion of a top surface of said conductive portion. |
| 申请公布号 |
US2015162218(A1) |
申请公布日期 |
2015.06.11 |
| 申请号 |
US201414561499 |
申请日期 |
2014.12.05 |
| 申请人 |
Enablink Technologies Limited |
发明人 |
CHEUNG Ka Wa |
| 分类号 |
H01L21/48;H01L21/56;H01L23/00 |
主分类号 |
H01L21/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of fabricating a receptacle down BGA carrier having a top surface and a bottom surface, the method comprising:
combining a conductive portion and a molded dielectric portion, the dielectric portion having an inner surface intersecting the top surface, the inner surface forming a cavity for receiving a die; selectively etching part of the conductive portion; and applying solder resist to a portion of a top surface of the conductive portion. |
| 地址 |
Tsuen Wan CN |
