发明名称 PLASMA PROCESSING APPARATUS AND FOCUS RING
摘要 A degree of tilting caused by consumption of a focus ring can be suppressed. A plasma processing apparatus includes a chamber configured to perform a plasma process on a target object; a mounting table which is provided within the chamber and has a mounting surface on which the target object is mounted; and the focus ring, provided on the mounting table to surround the target object mounted on the mounting surface, having a first flat portion lower than the mounting surface, a second flat portion higher than the first flat portion and not higher than a target surface of the target object, and a third flat portion higher than the second flat portion and the target surface of the target object in sequence from an inner peripheral side thereof to an outer peripheral side thereof.
申请公布号 US2015162170(A1) 申请公布日期 2015.06.11
申请号 US201414564371 申请日期 2014.12.09
申请人 TOKYO ELECTRON LIMITED 发明人 KISHI Hiroki;MIYAGAWA Masaaki;KITABATA Toshinori;IWATA Manabu
分类号 H01J37/32 主分类号 H01J37/32
代理机构 代理人
主权项 1. A plasma processing apparatus comprising: a chamber configured to perform a plasma process on a target object; a mounting table which is provided within the chamber and has a mounting surface on which the target object is mounted; and a focus ring, provided on the mounting table to surround the target object mounted on the mounting surface, having a first flat portion lower than the mounting surface; a second flat portion higher than the first flat portion and not higher than a target surface of the target object; and a third flat portion higher than the second flat portion and the target surface of the target object in sequence from an inner peripheral side thereof to an outer peripheral side thereof.
地址 Tokyo JP