TWO-PART EPOXY RESIN COMPOSITIONS WITH LATENT CURING AGENT

摘要

In one embodiment, a method of bonding a substrate is described. The method comprises providing an epoxy resin composition comprising a first liquid part comprising an epoxy resin; and a second liquid part comprising a combination of curing agents. The second liquid part comprises a first (e.g. ambient temperature) curing agent having an activation temperature at or below 20-25°C and a second latent curing agent having an activation temperature greater than 25°C. The method further comprises applying a mixture of the first and second part such that it contacts at least one substrate and curing the mixture below the activation temperature of the latent curing agent. The method does not include heating the mixture to the activation temperature of the latent curing agent. Rather, the latent curing agent can become activated during use of a substrate or article. In another embodiment, an article is described comprising at least one first substrate bonded with a cured epoxy resin composition wherein the cured epoxy resin composition comprises an uncured latent curing agent having an activation temperature greater than 25°C. Also described is a two-part epoxy resin composition comprising a first liquid part comprising an epoxy resin; and a second liquid part comprising a first curing agent having an activation temperature at or below 20-25°C and a second latent curing agent having an activation temperature greater than 25°C.