| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame substrate and a lead frame substrate manufacturing method, which inhibit generation of thick resin burrs when an electronic substrate is manufactured often by filling a metal frame having a metal removed part by etching, half etching with a resin in transfer molding thereby to improve quality and yield of the substrate.SOLUTION: A lead frame substrate comprises a die pad 7 for placing a semiconductor element and a lead 4 for connecting an electrode of the semiconductor element with an electrode of an external circuit, in which each of thicknesses of ends of the lead 4 on the die pad side and on the opposite side to the die pad side is equivalent to a thickness of a metal base to be used and a thickness of the lead in another region is formed thinner than each of the thicknesses of the ends of the lead on the die pad side and on the opposite side to the die pad side by half etching the metal base from a rear face, and a width of the end of the lead on the die pad side is formed narrower than a width of the end of the lead on the opposite side to the die pad side. |
