HIGH THERMAL CONDUCTOR AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To develop a novel high thermal conductor filler and apply the filler to a high thermal conductor.SOLUTION: A high thermal conductor is constituted by crystal silicon powder having cumulative 50% particle diameter Dof 0.01 to 50 μm and a matrix material. The high thermal conductor preferably has a thermal conductivity (HC) of a value or more calculated by the formula (1) depending on the content of the thermal conductive filler containing crystal silicon powder (Cf). HC(W/mK)≥(Cf (mass%)/50 (mass%))×0.8(W/mK) (1).