| 摘要 |
PROBLEM TO BE SOLVED: To attain an airtight sealing package for ensuring airtightness inside the package for a long time, or a sealing structure for reducing breakdown due to pressure from outside, by sealing by using a substrate.SOLUTION: A frame formed of semiconductor material is provided on a first substrate and joined to a second substrate comprising a semiconductor element. Thereby the first substrate and the second substrate are stuck together so that the semiconductor element is positioned inside the frame. The frame may be constituted by combining either two L-shaped semiconductor members, or the frame may be formed by combining four or more bar-shaped semiconductor members as frame members constituting the frame. |
