METHOD AND APPARATUS FOR TREATING A SKIN TISSUE

摘要

An apparatus for treating a skin tissue area (1) is provided, comprising: an energy source configured to heat the skin tissue area to a temperature in a range of about 55-65° C., a cooler configured to cool the skin tissue area to a temperature below about 40° C. Further, a skin tissue deformer configured to mechanically deform the skin tissue area into a deformed shape and to maintain the skin tissue area in the deformed shape, and a controller configured to operate the apparatus to perform a method of treating a skin tissue area (1). The method comprises the steps of: mechanically deforming the skin tissue area into a deformed shape; heating the skin tissue area to a temperature in a range between about 55° C. and about 65° C.; cooling the skin tissue area to a temperature below about 40° C. while maintaining the skin tissue area in the deformed shape, and the steps of reheating the skin tissue area to a temperature in a range between about 55° C. and about 65° C. while maintaining the skin tissue area in the deformed shape, and again cooling the skin tissue area to a temperature below about 40° C. while maintaining the skin tissue area in the deformed shape.

主权项

1. A method of treating a skin tissue area comprising the steps of:
mechanically deforming the skin tissue area into a deformed shape, after the step of mechanically deforming the skin tissue area into the deformed shape, heating the skin tissue area to a temperature in a range between about 55° C. and about 65° C. while maintaining the skin tissue area in the deformed shape, cooling the skin tissue area to a temperature below about 40° C. while maintaining the skin tissue area in the deformed shape, reheating the skin tissue area to a temperature in a range between about 55° C. and about 65° C. while maintaining the skin tissue area in the deformed shape, and again cooling the skin tissue area to a temperature below about 40° C. while maintaining the skin tissue area in the deformed shape.