| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a suspension substrate with a circuit that enables an electroless plating layer to protect a first conductor layer and/or a second conductor layer with implementation of stable electroless plating, and enables an electrolytic plating layer to protect a first terminal and/or a second terminal with simple implementation of electrolytic plating, and further improves a degree of design of the first conductor layer and the second conductor layer.SOLUTION: A manufacturing method of a suspension substrate with a circuit 1 is configured to: provide a first base insulation layer 62 so as to have a first base opening part 71 and a second base opening part 72 provided; provide a first conductor layer 63 so as to be filled in the first base opening part 71; provide a first electroless plating layer 64; provide a second base insulation layer 65 so as to have a third base opening part 73 provided; fill a second conductor layer 66 in the third opening part 73; provide a second electroless plating layer 67; remove the second electroless plating layer 67 of an exterior side terminal 15; remove a metal support substrate 3 of an undersurface of the first conductor layer 63; and provide an electrolytic plating layer 69 on a surface of the exterior side terminal 15 and the undersurface of the first conductor layer 63, and thereby the suspension substrate with the circuit 1 is manufactured. |
