SUBSTRATE HOLDING MECHANISM AND PEELING SYSTEM

摘要

PROBLEM TO BE SOLVED: To provide a substrate holding mechanism which is capable of suctioning and holding even a thin processed substrate having a large diameter so as to maintain the flatness and avoid damage of a protrusion at the electronic circuit side.SOLUTION: A substrate holding mechanism 241 performs peeling to an overlapped substrate T joined by an adhesive G to divide the overlapped substrate T into a processed substrate W and a support substrate S and holds the cleaned processed substrate W. The substrate holding mechanism 241 is formed by a porous chuck including a porous body 252 made of rubber. A coating agent 254, which prevents the processed substrate W from sticking to a suction surface 253, is applied to the suction surface 253 of the porous body 252 which suctions the processed substrate W.