EPOXY RESIN COMPOSITION INCLUDING SOLVATED SOLID

摘要

PROBLEM TO BE SOLVED: To provide good epoxy resin composition.SOLUTION: The epoxy resin composition comprises a curing component and an epoxy component. The curing component includes an amount of about 8 wt.% to about 70 wt.% of the composition of a first curing agent and about 0.001 wt.% to about 5 wt.% of the composition of a second curing agent. The second curing agent may be solid, especially, may be solvated. A liquid curing agent is obtained by a preparation of such the solvated solid. The epoxy composition also includes about 30 wt.% to about 92 wt.% of the epoxy component. The number of equivalents of reactive curative groups in the curing component is about 0.50 to 0.98 times of epoxide equivalents present in the epoxy component. An epoxy product is formed from the epoxy resin composition.