CORELESS BOARD FOR SEMI-CONDUCTOR PACKAGE AND THE METHOD OF MANUFACTURING THE SAME, THE METHOD OF MANUFACTURING OF SEMI-CONDUCTOR PACKAGE USING THE SAME

摘要

The present invention relates to a coreless substrate for a semiconductor package and a manufacturing method thereof. The coreless substrate for the semiconductor package according to one embodiment of the present invention includes a supporter, a buildup layer which is formed on the supporter, an external connection terminal which is formed on the buildup layer, and a solder resist layer which is formed on the buildup layer to expose the external connection terminal.