| 摘要 |
PROBLEM TO BE SOLVED: To simplify the wiring structure and efficiently radiate heat from an LED in a light emitting device using an individual light emitting element (LED).SOLUTION: A light emitting device 1 includes: an LED 2; a substrate 3 for mounting the LED 2; a sealing member 4 covering the LED 2; and a lead frame 6 electrically connected with the LED 2 via a wire 5. The lead frame 6 includes a stress relaxation part 9 formed by bending multiple sides and is disposed on a rear surface of the substrate 3. The substrate 3 has a mounting surface 31 formed by a flat surface on which the LED 2 is placed and a wire insertion hole 32 allowing the wire 5 to be inserted to the rear surface side. Since the LED 2 is connected with the lead frame 6 with the wire 5 passing through the wire insertion hole 32 in this structure, the wiring structure is simplified. Further, the heat radiation performance is improved because the mounting surface 31 is formed by the flat surface. Furthermore, the stress relaxation part 9 relaxes a stress occurring between the substrate 3 and the lead frame 6 and thereby preventing peeling of the lead frame 6 from the substrate 3. |
