发明名称 積層するための新規装置
摘要 <p>Disclosed is a device for laminating an electrode assembly including a cathode, an anode and a separator interposed therebetween laminated in this order by thermal bonding, the device including an inlet, through which a web having the cathode/separator/anode laminate structure is fed, a heater to heat the web and thereby induce thermal bonding between the cathode, the separator and the anode, an outlet through which the thermally bonded web is discharged, and a transporter to transport the web through the inlet, the heater and the outlet, wherein the transporter imparts a transport driving force to the web in a state that the transporter contacts at least one of the top and the bottom of the web and the heater directly heats a region of the transporter contacting the web and thereby transfers thermal bonding energy to the web.</p>
申请公布号 JP5731664(B2) 申请公布日期 2015.06.10
申请号 JP20130541917 申请日期 2011.11.09
申请人 发明人
分类号 H01M10/04 主分类号 H01M10/04
代理机构 代理人
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