| 摘要 |
<p>Provided is a probe pin for semiconductor inspection devices, wherein tin, which is the main component of a solder, is prevented from adhering to the contact section of the probe pin when the probe pin comes into contact with the solder, and a conductive film exhibiting excellent resistance to tin adhesion is formed on the surface of a base material. Specifically provided is a probe pin for semiconductor inspection devices which comprises a conductive base material and a copper-zirconium film containing copper and zirconium, wherein the proportion of the number of zirconium atoms relative to the total number of zirconium and copper atoms is 15 to 85 atom% in the copper-zirconium film, and the thickness of the film is 0.05 to 3 µm. Moreover, the copper-zirconium film also contains carbon atoms and, preferably, the proportion of the number of carbon atoms relative to the total number atoms in the copper-zirconium film is 40 atom% or less.</p> |
