| 摘要 |
In a method of laminating a transfer layer to a substrate, a transfer layer is provided on a carrier layer. Portions of the transfer layer are selectively removed from the carrier layer using an adhesive panel by heating portions of the adhesive panel corresponding to the portions of the transfer layer, and transferring the portions of the transfer layer from the carrier layer to the adhesive panel. A transfer section of the transfer layer is then transferred from the carrier layer to a surface of the substrate by fracturing the transfer layer along an edge of the transfer section. |
